TECO®
One-push-bonding
TECO is the innovative total etch bonding system from DMG. Besides its excellent bond strength properties TECO (= Total Etch Control) stands out with its unique DMG patented single dose application form: the SilvR dose. The material is activated by simply pressing on the silver chamber and can be used immediately – with one hand, quick and clean.
The fact that the user-friendly application does not compromise safety is proven by an independent American study. With its excellent bond strength of 38 MPa* TECO outclasses the competition. Additional assurance is provided by the very user-friendly total etch technique which allows working on moist areas after etching and thus preventing over-drying of the dentine.
With TECO in the »SilvR dose« you have everything under control. See for yourself how progressive bonding can be.
*Burgess,J.O.:»Comparison of Microtensile Bond Strength of different 5th Generation Bonding Systems«, University of Alabama, Birmingham UAB, USA, 2007, data on file ( DMG)
Types available
