TECO®
»One-push-bonding«
Indications
Light-curing bonding system for all commercially available light-cured materials.
Advantages
- Outstanding bonding properties: With 38 MPa* TECO far outclasses the market standards
*Burgess,J.O.:»Comparison of Microtensile Bond Strength of different 5th Generation Bonding Systems«, University of Alabama, Birmingham UAB, USA, 200 - Very easy and hygienic application by innovative single dose application form: »SilvR dose«
- Only one component to apply after etching procedure reduces the risk of misuse
- Very user-friendly total etch technique – allows working on moist areas thus preventing damaging the collagen network
