TECO
Light-curing bonding system for all commercially available light-cured materials
- Outstanding bonding properties: With 38 MPa TECO far outclasses the market standards
- Very easy and hygienic application by innovative single dose application form: »SilvR dose«
- Only one component to apply after etching procedure reduces the risk of misuse
- Very user-friendly total etch technique – allows working on moist areas thus preventing damaging the collagen network





